PowerPoint Presentation On Microvia Technology

Presentation On Microvia Technology

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Microvia Technology Presentation Transcript:

1. NEED OF MICROVIA
The development of very complex ICs with extremely high input output has forced the electronic manufacturer to develop new packaging and assembly techniques. Components with pitches less than 0.30mm,chip scale packages and flip chip tech are underlining this trend and highlight importance of new PCBs

2. REQUIREMENTS TO MICROVIA
Clean vias without residue. No delamination of copper and substrate. Big land diameter for robust interconnection to the inner layer.

3. MICROVIA FORMATION FORMATION METHODS:
Mechanically drilled vias. Etching. Plasma etching. Laser drilling.

4. COMPARISION
The following graph shows the dynamic range in hole sizes that different methods offer:

5. FUTURE APPLICATIONS:
In Automobile industries. Intelligent devices and systems. Mobiles phones. Also expected in Computers

6. Thanks.